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| Categories | Silicon Wafer |
|---|---|
| Brand Name: | GaNova |
| Model Number: | JDCD06-001-006 |
| Certification: | UKAS/ISO9001:2015 |
| Place of Origin: | Suzhou China |
| MOQ: | 1 |
| Payment Terms: | T/T |
| Supply Ability: | 50000pcs/month |
| Delivery Time: | 3-4 week days |
| Packaging Details: | Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers. |
| Diameter: | 12" |
| Grade: | Prime |
| Growth Method: | CZ |
| Orientation: | <1-0-0>,<1-1-1>,<1-1-0> |
| Type/Dopant: | P Type/Boron,N Type/Phos,N Type/As, N Type/Sb |
| Thickness(μm): | 775 |
| Thickness Tolerance: | Standard ± 25μm,Maximum Capabilities ± 5μm |
| Resistivity: | 0.001-100 ohm-cm |
| Surface Finished: | P/E,P/P,E/E,G/G |
| TTV(μm): | Standard <10 um,Maximum Capabilities<5 um |
| Bow/Warp: | Standard <40 um,Maximum Capabilities<20 um |
| Particle: | <10@0.5um; <10@0.3um; <10@0.2um; |
12-inch silicon wafer MEMS devices, integrated circuits,dedicated substrates for discrete devices
Overview
A silicon wafer is a material essential for manufacturing
semiconductors, which are found in all kinds of electronic devices
that enrich our lives. Few of us have a chance to encounter an
actual silicon wafer in daily life.
Usually this printing process involves many steps in which
different layers are stacked up on the silicon wafer surface, each
layer with a different pattern, so the final result can be a
complex design of electronic components and interconnecting wires.
This printing process is usually called "microlithography."
Specification
silicon wafer | |
Diameter | 2"/3"/4"/5"/6"/8"/12" |
| Grade | Prime |
| Growth Method | CZ |
| Orientation | <1-0-0>,<1-1-1>,<1-1-0> |
| Type/Dopant | P Type/Boron,N Type/Phos,N Type/As, N Type/Sb |
| Thickness(μm) | 279/380/525/625/675/725/775 |
| Thickness Tolerance | Standard ± 25μm,Maximum Capabilit/ies ± 5μm |
| Resistivity | 0.001-100 ohm-cm |
| Surface Finished | P/E,P/P,E/E,G/G |
| TTV(μm) | Standard <10 um,Maximum Capabilities<5 um |
| Bow/Warp | Standard <40 um,Maximum Capabilities<20 um |
| Particle | <10@0.5um; <10@0.3um; <10@0.2um; |
About Us
We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.
FAQ
Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according
to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the
cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.
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MEMS Devices Silicon Substrates Integrated Circuits Dedicated
