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OEM IGBT Power Module 1200V 300A Half Bridge Module DS-SPS300B12G6M4-S04020025

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OEM IGBT Power Module 1200V 300A Half Bridge Module DS-SPS300B12G6M4-S04020025

Solid Power-DS-SPS300B12G6M4-S04020025


1200V 300A IGBT Half Bridge Module


Features:



□ 1200V Trench+ Field Stop technology

□ Freewheeling diodes with fast and soft reverse recovery

□ VCE(sat) with positive temperature coefficient

□ Low switching losses



Typical Applications:


□ Inductive heating

□ Welding

□ High frequency switching application




Package

ItemSymbolConditionsValuesUnit

Isolation test voltage

VISOLRMS, f = 50 Hz, t =1 min

4.0


kV


Material of module baseplate

Cu


Internal isolation

(class 1, IEC 61140)

Basic insulation (class 1, IEC 61140)

Al2O3


Creepage distance

dCreepterminal to heatsink29.0

mm

dCreepterminal to terminal23.0

Clearance

dClearterminal to heatsink23.0

mm

dClearterminal to terminal11.0

Comparative tracking index

CTI

>400

ItemSymbolConditionsValuesUnit
Min.Typ.Max.

Stray inductance module

LsCE

20


nH


Module lead resistance, terminals - chip

RCC’+EE’TC=25℃

0.70



Storage temperature

Tstg

-40


125


Mounting torque for module mounting

M6

3.0


6.0


Nm


Terminal connection torque

M6

2.5


5.0


Nm


Weight

G

320


g



IGBT

Maximum Rated Values

ItemSymbolConditionsValuesUnit

Collector-emitter Voltage

VCESTvj=25℃

1200


V


Maximum gate-emitter voltage

VGES

±20


V


Transient gate-emitter voltage

VGEStp≤10μs,D=0.01

±30


V


Continuous DC collector current

ICTC=25℃400

A

TC=100℃300

Pulsed collector current,tp limited by Tjmax

ICpulse

600


A


Power dissipation

Ptot

1500


W



Characteristic Values

ItemSymbolConditionsValuesUnit
Min.Typ.Max.

Collector-emitter saturation voltage

VCE(sat)IC=300A, VGE=15VTvj=25℃1.501.80

V

Tvj=125℃1.65
Tvj=150℃1.70

Gate threshold voltage

VGE(th)VCE=VGE, IC=12mA

5.0

5.8

6.5


V


Collector-emitter cut-off current

ICESVCE=1200V, VGE=0VTvj=25℃100µA
Tvj=150℃5mA

Gate-emitter leakage current

IGESVCE=0V,VGE=±20V, Tvj=25℃-200200nA

Gate Charge

QGVCE=600V, IC=300A , VGE=±15V3.2μC

Input Capacitance

CiesVCE=25V, VGE=0V, f =100kHz60.0

nF


Output Capacitance

Coes1.89

Reverse Transfer Capacitance

Cres0.54

Internal gate resistor

RGintTvj=25℃1.2Ω

Turn-on delay time,inductive load

td(on)VCC=600V,IC=300A RG=1.8Ω, VGE=±15VTvj=25℃130ns
Tvj=125℃145ns
Tvj=150℃145ns

Rise Time,inductive load

trTvj=25℃60ns
Tvj=125℃68ns
Tvj=150℃68ns

Turn-off delay time,inductive load

td(off)VCC=600V,IC=300A RG=1.8Ω, VGE=±15VTvj=25℃504ns
Tvj=125℃544ns
Tvj=150℃544ns

Fall time,inductive load

tfTvj=25℃244ns
Tvj=125℃365ns
Tvj=150℃370ns

Turn-on energy loss per pulse

EonVCC=600V,IC=300A RG=1.8Ω, VGE=±15VTvj=25℃7.4mJ
Tvj=125℃11.1mJ
Tvj=150℃11.6mJ

Turn off Energy loss per pulse

EoffTvj=25℃32.0mJ
Tvj=125℃39.5mJ
Tvj=150℃41.2mJ

SC data

ISCVGE≤15V, VCC=600Vtp≤10µs Tvj=150℃

1350


A


IGBT thermal resistance,junction-case

RthJC0.1K /W

Operating Temperature

TJop-40150


Diode

Maximum Rated Values

ItemSymbolConditionsValuesUnit

Repetitive reverse voltage

VRRMTvj=25℃

1200

V


Continuous DC forward current

IF

300


A


Diode pulsed current,tp limited by TJmax

IFpulse600

Characteristic Values

ItemSymbolConditionsValuesUnit
Min.Typ.Max.

Forward voltage

VFIF=300A , VGE=0VTvj=25℃2.302.70

V

Tvj=125℃2.50
Tvj=150℃2.50

Reverse recovery time

trr

IF=300A

dIF/dt=-4900A/μs (Tvj=150°C) VR=600V,

VGE=-15V

Tvj=25℃90

ns

Tvj=125℃120
Tvj=150℃126

Peak reverse recovery current

IRRMTvj=25℃212

A

Tvj=125℃245
Tvj=150℃250

Reverse recovery charge

QRRTvj=25℃19

µC

Tvj=125℃27
Tvj=150℃35

Reverse recovery energy loss per pulse

ErecTvj=25℃7.7

mJ

Tvj=125℃13.3
Tvj=150℃14.0

Diode thermal resistance,junction-case

RthJCD

0.23

K /W


Operating Temperature

TJop

-40

150




Output characteristic(typical) Output characteristic(typical)

IC = f (VCE) IC = f (VCE)

Tvj= 150°C





IGBT

Transfer characteristic(typical) Switching losses IGBT (typical)

IC = f (VGE) E = f (RG)

VCE = 20V VGE = ±15V, IC = 300A, VCE = 600V


IGBT RBSOA

Switching losses IGBT (typical) Reverse bias safe operating area(RBSOA)

E = f (IC) IC =f (VCE)

VGE = ±15V, RG = 1.8Ω , VCE = 600V VGE = ±15V, RGoff = 1.8Ω, Tvj = 150°C





Typical capacitance as a function of collector-emitter voltage Gate charge (typical)

C = f (VCE) VGE = f (QG)

f = 100 kHz, VGE = 0V IC = 300A, VCE = 600V



IGBT

IGBT transient thermal impedance as a function of pulse width Forward characteristic of Diode (typical)

Zth(j-c) = f (t) IF = f (VF)



Switching losses Diode(typical) Switching losses Diode(typical)

Erec = f (RG) Erec = f (IF)

IF = 300A, VCE = 600V RG = 1.8Ω, VCE = 600V



Diode transient thermal impedance as a function of pulse width

Zth(j-c) = f (t)



An IGBT half-bridge module is a power electronic device that combines two Insulated Gate Bipolar Transistors (IGBTs) arranged in a half-bridge configuration. This configuration is commonly used in various applications where bidirectional control of power is required. Here are some key points about IGBT half-bridge modules:
1. IGBTs: IGBTs are semiconductor devices that combine the characteristics of both insulated gate field-effect transistors (IGFETs) and bipolar junction transistors (BJTs). They are widely used in power electronics for switching and controlling electrical power.
2. Half-Bridge Configuration: The half-bridge configuration consists of two IGBTs connected in series, forming a bridge circuit. One IGBT is responsible for conducting during the positive half-cycle of the input waveform, while the other conducts during the negative half-cycle. This arrangement allows bidirectional control of the current.
3. Voltage and Current Ratings: IGBT half-bridge modules are specified with voltage and current ratings. For example, a common rating might be 1200V/300A, indicating the maximum voltage and current the module can handle.
4. Applications: IGBT half-bridge modules find applications in motor drives, inverters, power supplies, and other systems requiring controlled power switching. They are suitable for applications where variable speed control or power inversion is needed.
5. Cooling and Thermal Management: As with individual IGBTs, IGBT half-bridge modules generate heat during operation. Adequate cooling methods, such as heatsinks or other thermal management systems, are crucial to maintain proper device performance and reliability.
6. Gate Drive Circuitry: Proper gate drive circuitry is essential to control the switching of IGBTs effectively. This includes ensuring that the gate signals are appropriately timed and have sufficient voltage levels.
7. Datasheet: Users should refer to the manufacturer's datasheet for detailed specifications, electrical characteristics, and application guidelines specific to the IGBT half-bridge module they are using.
IGBT half-bridge modules are widely employed in industrial and automotive applications for their capability to handle high power levels and provide efficient and controlled switching of electrical currents.



Circuit diagram headline



Package outlines



Dimensions in (mm)

mm

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